- Business Unit
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Glass fiber cloth/PTFE/fine ceramic powder can be added to the laminates for multi-layer PCB. It has unique thermal stability (CTE) and minimal dielectric constant temperature drift, and has the best processability.
Features:
•Excellent Thermal Coefficient of Dielectric Constant
•Excellent PIM Performance
•High Thermal Conductivity ideal for Higher Power Designs.
•Reduced Coefficient of Thermal
Expansion in Z-direction (CTEz)
•Tightest Commercial Laminate DK Tolerance for Impedance Control
Features:
•Extremely Low Loss Tangent (0.0009 @10GHz)
•Excellent Dimensional Stability
•Excellent Product Performance Uniformity
Features:
• “Best in Class” Thermal Conductivity( 0.8 W / m K )
• Dielectric Constant Stability across Wide Temperatures( - 9 pp m / ℃)
• Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency
• Priced Affordably for Commercial Application
• High Peel Strength for Reliable
Copper Adhesion in thermally stressed applications
• Meet Military Standard for Shock and Impact Resistance Test
Features:
•Ceramic/PTFE Microwave Composite
•Lowest Insertion Loss in Class
•“Best-in-Class” Loss Tangent (0.0010)
•Electrical Phase Stability vs.
Temperature
•High Thermal Conductivity
•Tightest Dielectric Constant (±0.03) and Thickness Tolerance
RA300
Features:
•Ceramic/PTFE Microwave Composite
•Lowest Insertion Loss in Class
•“Best-in-Class” Loss Tangent (0.0011)
•Electrical Phase Stability
•High Thermal Conductivity
•Tightest Dielectric Constant (±0.03) and Thickness Tolerance
Features and Benefits:
•Low dielectric constant ( @10GHz Dk 3.20)and dissipation (@10GHz Df 0.0030)
•High glass transition temperature(Tg 280℃)
•Low press temperature 180℃
•Reliable multiple press characteristics
•Good blind hole filling effect
•Excellent thickness uniformity
Features and Benefits:
•Low Dielectric Loss(0.0013 @10GHz)
•Excellent Mechanical Properties vs. Temperature
•Reliable Strip Line and Multi-layer Board Constructions
•Suitable for Use with Epoxy Glass Multilayer Board Hybrid Designs
•Stable Dielectric Constant vs.
Temperature and Frequency
•Suitable for Applications Sensitive to
Temperature Change
•Excellent Dimensional Stability