Features:

• “Best  in Class”  Thermal Conductivity( 0.8 W / m K ) 

• Dielectric Constant Stability across Wide Temperatures( - 9  pp m / ℃)

• Very  Low Loss Tangent  provides Higher Amplifier or Antenna  Efficiency

• Priced Affordably for Commercial Application

• High  Peel  Strength for Reliable

Copper Adhesion in thermally stressed applications

• Meet Military Standard for Shock and Impact Resistance Test

Benefits:

• Heat Dissipation and  Management

• Improved Processing and Reliability

• Large  Panel Sizes  for Multiple Circuit Layout for lowered Processing Costs

Typical Applications:

• Power Amplifiers, Filters and Couplers

• Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)

• Thermally Cycled Antennas sensitive to dielectric  drift

• Microwave Combiner  and Power Dividers