Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Features and Benefits:
•Low dielectric constant ( @10GHz Dk 3.20)and dissipation (@10GHz Df 0.0030)
•High glass transition temperature(Tg 280℃)
•Low press temperature 180℃
•Reliable multiple press characteristics
•Good blind hole filling effect
•Excellent thickness uniformity
Typical Applications:
•Radar
•Antennas
•RF couplers
•Filter
•Passive components
•Power amplifier
Corporate Responsibility