Features:
•Excellent Thermal Coefficient of  Dielectric Constant
•Excellent PIM Performance
•High Thermal Conductivity ideal for  Higher Power Designs.
•Reduced Coefficient of Thermal
Expansion in Z-direction (CTEz)
•Tightest Commercial Laminate DK  Tolerance for Impedance Control

Benefits:
•Low Dielectric Loss (Loss Tangent)
•Low Insertion Loss (S21)
•Excellent Electrical Phase
Stability vs. Temperature
•Excellent Copper Bond Strength
•Low Water Absorption

Typical Applications:
•Base Station Antennas
•Power Amplifiers (PA), Tower Mounted Amplifiers (TMA) and Tower Mounted Booster Amplifiers  (TMB)
•Antenna Feed Networks
•RF Passive Components
•Multimedia Transmission Systems