Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Features:
•Ceramic/PTFE Microwave Composite
•Lowest Insertion Loss in Class
•“Best-in-Class” Loss Tangent (0.0010)
•Electrical Phase Stability vs.
Temperature
•High Thermal Conductivity
•Tightest Dielectric Constant (±0.03) and Thickness Tolerance
Benefits:
•Excellent Thermal Stability of DK and Df
•Phase Stability vs. temperature
•High Degree of Dimensional
Stability Required for Complex,
Multi-layer Boards
•Excellent CTE in X,Y and Z Directions
Typical Applications:
•Defense Microwave/RF Applications
•Radar
•Phase Fed Array Antennas
•Microwave Feed Networks
•CNI (communication, navigation and identification) Applications
•SIGINT, Satellite & Space Electronics
•Other High Frequency and High Speed Applications
Corporate Responsibility